关于德芯
产品可靠性

1、产品可靠性测试项目

全系列产品依照 JEDEC and AEC101标准通过半导体功率器件的可靠性測試

Test Iteam Description Test Condition Duration Ref.Standard
PC 预处理 Pre-test & V/M TMCL -> Bake Soak (MSL 1)
IR Reflow Post-test & V/M
Pre &Post- test JESD22-A113
ACLV(PCT) 高压蒸煮试验 TA=121°C / 100%RH, Gauge Pressure 15 psig ;
Unbiased.
24/96 Hours JESD22-A102
HTSL 高温贮存寿命试验 TA=150°C, or specified maximum storage
temperature.
168/500/1000 Hours JESD22-A103
RSH 耐焊热试验 TA=260°C, 10 Sec. (for SMD)
TA=270°C, 7 Sec. (for Thr-Hole)
1 Cycle JESD22-A111
JESD22-B106
TMCL(TCH) 高低温温度循环试验 TA=-65°C to +150°C, dwell time 15min.
(30min/cycle), Air to air
100/500/1000 Cycles JESD22-A104
H3TRB(THB) 高温高湿反偏试验 TA=85°C, 85%RH, 80% of rated BV ; or up to a
maximum of 100V
168/500/1000 Hours JESD22-A101
HTRB 高温反偏试验 TA=150°C or specified max. Tj (T A is to be adjusted
to compensate for leakage ) , 80% of rated BV
168/500/1000 Hours JESD22-A108
HTGB
高温栅偏试验(仅适用于MOSFET产品)
TA=150°C or specified max. T; (T A is to be adjusted
to compensate for leakage), 100% of rated VGS
168/500/1000 Hours JESD22-A108
OPL 工作寿命试验 TA=25°C, max. power rating or powered to max. Tj 168/500/1000 Hours JESD22-A108
IOL 间歇工作寿命试验 TA=25 0 C, ATj 2 100 〇 C, t 0N =t 0FF =2 min (or 3_5 min} 2520/7500/15000 Cycles MIL-STD-750
Method 1037


2、产品可靠性测试报告

Part Number Reliability Test Report
DT8T35I
DT12T35I
DT16T35I
DT4T10F
DT16T35E